IEEE 6G Summit and IEEE Chips Summit Dresden Exhibition

Der diesjährige IEEE 6G Summit ist Teil des Dresden Chips & Communications Festival 2025 (DCCF). Das DCCF und seine vielen Teilveranstaltungen bilden vielseitige Tage mit umfassendem wissenschaftlichem Dialog, spannenden Vorträgen und Innovationen zu 6G und jenseits von 5G. Neben dem hochkarätigen IEEE 6G Summit Dresden mit Präsentationen von Führungskräften aus Wissenschaft und Industrie am 15. Mai wird das DCCF am 14. Mai auch den ersten IEEE Chips Summit Dresden bieten, mit dem es eine zweitägige Ausstellung geben wird, die das Potenzial der 5G- und 6G-Technologie präsentiert.

Your trade fair appearance

The next IEEE 6G Summit and IEEE Chips Summit Dresden Exhibition in Dresden is already scheduled from 14.05.2025 to 15.05.2025. If you haven't reserved your booth space yet, it's time to do so. You may not be able to get your preferred spot and will have to make do with what's still available. So how you design and set up your booth is crucial to compensate for any location disadvantages with creative solutions. Your booth represents your company at IEEE 6G Summit and IEEE Chips Summit Dresden Exhibition and should therefore always be professional, inviting and well planned.

Your trade fair booth

Since IEEE 6G Summit and IEEE Chips Summit Dresden Exhibition takes place annually, it is always an opportunity to present yourself creatively and set trends. Innovations open up new possibilities, while tried and tested classics maintain tradition. This connection can often guarantee the success of future events. A modular trade fair system is similar: it offers you more flexibility so that you can adapt your stand to the space and current design trends every year. Take advantage of the advantages of the modules and decide whether renting or buying is best for your company and the respective situation.

Rent an exhibition booth

An experienced team of experts is at your side and supports you in planning and implementing your exhibition stand for IEEE 6G Summit and IEEE Chips Summit Dresden Exhibition. Thanks to our modular matogo.System 50, you can design your stand according to your personal requirements and adapt it flexibly. The tool-free assembly, the small packing dimensions and the low weight of our reusable aluminum frame system reduce transport and handling costs, and it is also sustainable because nothing has to be thrown away. Everything is reusable! Decide on a headstand, row stand, corner stand or island stand, with or without storage space: With our modular system, you can even create islands within your stand with the „bridge elements“. Exhibitors from abroad, from Great Britain to Greece to South Korea, already use the professional assembly service if they do not have the time or inclination to assemble the stand themselves. With matogo. you will find a partner for an individual trade fair appearance.

Trade fair location Dresden

Regardless of the trade fair location, we also offer you a set-up and dismantling service at your location.

Additional services

It starts with the design: How can the modular system be used effectively for various trade fair concepts? This is particularly important if you want to create different appearances with one system. This is where the experienced team at matogo. comes into play to show you ways to make the best use of costs. If you clearly formulate your requirements in advance, we can prepare the graphics so that they can also be used in other setup versions. We are also happy to take on other stand elements such as rental furniture, multimedia technology or anything else you need for your trade fair appearance.
Let us try it out - matogo. will make it happen!

 

Ask us, service [at] matogo.de (subject: contact%20by%20rent%20a%20booth, body: %3Cyour%20question%3E) we also speak English.

 

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